High strength in wide temperature range (-230°C – +370°C),
High stiffness,
Good electrical insulating (for virgin product),
Good tribological behaviour (for composite versions)
Good resistance to high energy radiation (Gamma and Röntgen),
Flame resistance (difficult to burn),
Excellent chemical resistance,
Cutting (turning, milling, drilling, sawing): hard metal, diamond can be used only in sharp design. Cooling is recommended, which allows high cutting rates, e. g. v = 250-500 m/min for turning and milling, v = 10 –30 m/min for drilling.
Adhesive bonding: feasible.
Polyimide (PI) Products
TECASINT 1011
Unreinforced, natural, amorf PI. Among Tecasint polyimides this version ha the best electrical insulation capability.
Series of Tecasint 1000: have very high modulus, high rigidity and hardness.
TECASINT 1021
Improved sliding properties due to 15w% graphite. The electrical conductivity is also better comparing to the natural PI.
TECASINT 1031
It contains 40w% graphite comparing to the natural Tecasint 1011.
TECASINT 1041
Comparing to the natural PI it contains 30% MoS2, which can modify the fiction and wear resistance.
Series of Tecasint 1000: have very high modulus, high rigidity and hardness.
TECASINT 1061
Especially developed for better sliding and wear resistance at high emperature applications.
Series of Tecasint 1000: have very high modulus, high rigidity and hardness.
It contains 15% praphite and 10% PTFE.
TECASINT 1611
It has 30% PTFE additives. Modified tribological behaviour and mechanical properties.
Series of Tecasint 1000: have very high modulus, high rigidity and hardness.
TECASINT 2011
Unreinforced, natural, amorf PI with reduced moisture adsorption.
Series of Tecasint 2000: have very high modulus, high rigidity, but compared to series of 1000 reduced moisture adsorption beside higher toughness and machining capability.
TECASINT 2021
Improved sliding properties due to 15w% graphite. The electrical conductivity is also better comparing to the natural Tecasint 2011.
Series of Tecasint 2000: have very high modulus, high rigidity, but compared to series of 1000 reduced moisture adsorption beside higher toughness and machining capability.
TECASINT 2031
It contains 40w% graphite comparing to the natural Tecasint 2011.
Series of Tecasint 2000: have very high modulus, high rigidity, but compared to series of 1000 reduced moisture adsorption beside higher toughness and machining capability.
TECASINT 2061
Composite designed for high speed sliding applications. Very good wear resistance and low friction at elevated temperatures, too. Comparing to the natural Tecasint 2011 it contains 15% graphite and 10% PTFE.
Series of Tecasint 2000: have very high modulus, high rigidity, but compared to series of 1000 reduced moisture adsorption beside higher toughness and machining capability.
TECASINT 2391
Modified tribological behaviour due to 15% MoS2 in the natural version.
Series of Tecasint 2000: have very high modulus, high rigidity, but compared to series of 1000 reduced moisture adsorption beside higher toughness and machining capability.
TECASINT 8001
20% PI content on PTFE matrix.
Series of Tecasint 8000: matrix of PTFE reinforced with PI powder. Extreme chemical resistance and good tribological properties and machinability.
Vespel SP-1
Unfilled, unreinforced polyimide, which has the best mechanical characteristics and electrical insulating capability among PI products. It can be used at 450°C for a brief period, long-term use is possible around 240°C.
Vespel SP-21
It contains 15% graphite in order to ensure better friction and wear properties.
Vespel SP-211
It contains 15% graphite and 10% PTFE to further improve the friction and wear properties.
Vespel SP-22
It contains 40% graphite.
Vespel SP-3
It contains 15% MoS2 as a solid lubricant.